The pin grid array, which is a collection of metal wires on the bottom of the chip and fits into a slot on the motherboard, is supported by a plastic framework in a processor container known as a PPGA. Its use of plastic as opposed to porcelain or other materials distinguishes it from other kinds of pin grid array packing. Because the material is inexpensive and rapidly removes heat, computers can use more circuits and operate at faster rates.

On a number of its first Celeron CPUs, Intel used a PPGA design. These Processor CPUs, which were manufactured between 1998 and 2000, were well-liked because of how powerful they were in comparison to Intel's more costly Pentium II line. Overclockers also preferred them because they discovered the processors to be reliable when used at higher rates than Intel formally permitted.

When Intel started shifting away from the slot-based processors of the early Pentium II and Celeron models, the PPGA packing was launched. After Intel debuted the FCPGA (flip-chip pin grid array) packing with the Pentium III line in 2000, PPGA itself was no longer in use. LGA (land grid array) packaging eventually took the place of pin grid array packaging, in which the pins are situated inside the receptacle and are connected to planar contacts on the chip's bottom.